Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11212912 | Printed circuit board mesh routing to reduce solder ball joint failure during reflow | Shu-Ming Chang, Dillip K. Dash, Po-Chun Yang, Juan-Yi Wu | 2021-12-28 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11212912 | Printed circuit board mesh routing to reduce solder ball joint failure during reflow | Shu-Ming Chang, Dillip K. Dash, Po-Chun Yang, Juan-Yi Wu | 2021-12-28 |