JW

Juan-Yi Wu

Microsoft: 1 patents #1,811 of 6,492Top 30%
Overall (2021): #385,483 of 548,734Top 75%
1
Patents 2021

Issued Patents 2021

Patent #TitleCo-InventorsDate
11212912 Printed circuit board mesh routing to reduce solder ball joint failure during reflow Benito Joseph Rodriguez, Shu-Ming Chang, Dillip K. Dash, Po-Chun Yang 2021-12-28