Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201109 | Hermetic metallized via with improved reliability | Prantik Mazumder, Chukwudi Azubuike Okoro, Ah-Young Park, Scott Christopher Pollard, Rajesh Vaddi | 2021-12-14 |
| 11192299 | Method and apparatus for improved surface cure for three dimensional printed parts | Seemit Praharaj, Paul J. McConville, Patrick J. Howe | 2021-12-07 |
| 11186518 | Methods of making a glass article with a structured surface | Tracie Lynne Carleton, Leonard Charles Dabich, II, David Alan Deneka, Shenping Li, Xiang-Dong Mi +6 more | 2021-11-30 |
| 11152294 | Hermetic metallized via with improved reliability | Tian Huang, Ekaterina Aleksandrovna Kuksenkova, Prantik Mazumder, Chad Byron Moore, Chukwudi Azubuike Okoro +3 more | 2021-10-19 |
| 11130353 | Thermoformable overcoat in roll-to-roll format printers for thermoforming applications | Xin Yang, Peter J. Knausdorf, Anthony S. Condello, Jack T. LeStrange | 2021-09-28 |