Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152294 | Hermetic metallized via with improved reliability | Mandakini Kanungo, Ekaterina Aleksandrovna Kuksenkova, Prantik Mazumder, Chad Byron Moore, Chukwudi Azubuike Okoro +3 more | 2021-10-19 |
| 11078112 | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same | Rachel Eileen Dahlberg, Yuhui Jin, Garrett Andrew Piech, Daniel Ohen Ricketts | 2021-08-03 |
| 11062986 | Articles having vias with geometry attributes and methods for fabricating the same | Yuhui Jin, Matthew Evan Wilhelm | 2021-07-13 |