Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201109 | Hermetic metallized via with improved reliability | Mandakini Kanungo, Prantik Mazumder, Ah-Young Park, Scott Christopher Pollard, Rajesh Vaddi | 2021-12-14 |
| 11171094 | Hermetic fully-filled metallized through-hole vias | Prantik Mazumder, Ah-Young Park, Scott Christopher Pollard, Navaneetha Krishnan Subbaiyan | 2021-11-09 |
| 11152294 | Hermetic metallized via with improved reliability | Tian Huang, Mandakini Kanungo, Ekaterina Aleksandrovna Kuksenkova, Prantik Mazumder, Chad Byron Moore +3 more | 2021-10-19 |