Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171094 | Hermetic fully-filled metallized through-hole vias | Prantik Mazumder, Chukwudi Azubuike Okoro, Ah-Young Park, Scott Christopher Pollard | 2021-11-09 |
| 11158519 | Method of forming capped metallized vias | William Richard Trutna | 2021-10-26 |