Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152294 | Hermetic metallized via with improved reliability | Tian Huang, Mandakini Kanungo, Prantik Mazumder, Chad Byron Moore, Chukwudi Azubuike Okoro +3 more | 2021-10-19 |
| 10932371 | Bottom-up electrolytic via plating method | Robert Alan Bellman, John Tyler Keech, Scott Christopher Pollard | 2021-02-23 |