Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11192299 | Method and apparatus for improved surface cure for three dimensional printed parts | Seemit Praharaj, Mandakini Kanungo, Paul J. McConville | 2021-12-07 | $13,694,000 |