Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11120999 | Plasma etching method | Koichi Yatsuda, Nagisa Sato, Kumiko Ono, Shigeru Tahara, Jacques Faguet +4 more | 2021-09-14 |
| 10978300 | Methods to reduce gouging for core removal processes using thermal decomposition materials | Yuki Kikuchi, Toshiharu Wada, Akiteru Ko | 2021-04-13 |
| 10950442 | Methods to reshape spacers for multi-patterning processes using thermal decomposition materials | Yuki Kikuchi, Toshiharu Wada, Akiteru Ko | 2021-03-16 |
| 10916428 | Method to transfer patterns to a layer | Yuki Kikuchi, Toshiharu Wada, Akiteru Ko | 2021-02-09 |
| 10886176 | Self-aligned interconnect patterning for back-end-of-line (BEOL) structures including self-aligned via through the underlying interlevel metal layer | Yuki Kikuchi | 2021-01-05 |