Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127635 | Techniques for wafer stack processing | Cheng-Hsien Chou, Cheng-Yuan Tsai, Kuo-Ming Wu, Hau-Yi Hsiao | 2021-09-21 |
| 11087971 | Method for manufacturing semiconductor device and manufacturing method of the same | Hau-Yi Hsiao, Chih-Hui Huang, Kuo-Hwa Tzeng, Cheng-Hsien Chou | 2021-08-10 |
| 11024602 | Hybrid bond pad structure | Sin-Yao Huang, Chun-Chieh Chuang, Ching-Chun Wang, Sheng-Chau Chen, Dun-Nian Yaung +1 more | 2021-06-01 |