Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211496 | FinFET device and method of forming | Te-Chih Hsiung, Cha-Hsin Chao, Yi-Wei Chiu | 2021-12-28 |
| 11139174 | Method for forming features of semiconductor structure having reduced end-to-end spacing | Yun-Yu Hsieh, Cha-Hsin Chao, Li-Te Hsu | 2021-10-05 |
| 11075279 | Metal gate and contact plug design and method forming same | Chih-Teng Liao, Yi-Wei Chiu, Chia-Ching Tsai | 2021-07-27 |
| 11049756 | Thermal pad for etch rate uniformity | Chin-Huei Chiu, Tsung Fan Yin, Chen-Yi Liu, Hua-Li Hung, Yi-Wei Chiu | 2021-06-29 |
| 11022878 | Critical dimension uniformity | Cha-Hsin Chao, Yi-Wei Chiu, Li-Te Hsu, Chih-Hsuan Lin | 2021-06-01 |
| 10985053 | Contact plugs and methods of forming same | Y. H. Kuo, Cha-Hsin Chao, Yi-Wei Chiu, Li-Te Hsu | 2021-04-20 |