Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11139174 | Method for forming features of semiconductor structure having reduced end-to-end spacing | Xi-Zong Chen, Cha-Hsin Chao, Li-Te Hsu | 2021-10-05 |
| 11088025 | Contact structure for semiconductor device | Jeng Chang Her, Cha-Hsin Chao, Yi-Wei Chiu, Li-Te Hsu, Ying Ting Hsia | 2021-08-10 |