Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11100272 | Wafer-to-design image analysis (WDIA) system | Cheng-Chi Wu | 2021-08-24 |
| 11061317 | Method of fabricating an integrated circuit with non-printable dummy features | Jyuh-Fuh Lin, Cheng-Hung Chen, Pei-Yi Liu, Shy-Jay Lin, Burn Jeng Lin | 2021-07-13 |
| 10955746 | Lithography method with reduced impacts of mask defects | Shinn-Sheng Yu, Ching-Fang Yu, Ting-Hao Hsu, Sheng-Chi Chin, Anthony Yen | 2021-03-23 |