Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11061317 | Method of fabricating an integrated circuit with non-printable dummy features | Jyuh-Fuh Lin, Cheng-Hung Chen, Wen-Chuan Wang, Shy-Jay Lin, Burn Jeng Lin | 2021-07-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11061317 | Method of fabricating an integrated circuit with non-printable dummy features | Jyuh-Fuh Lin, Cheng-Hung Chen, Wen-Chuan Wang, Shy-Jay Lin, Burn Jeng Lin | 2021-07-13 |