Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114359 | Wafer level chip scale package structure | Jesus Mennen Belonio, Jr., Ian Kent, Ernesto Gutierrez, III, Jerry Li | 2021-09-07 |
| 11094669 | Wafer level molded PPGA (pad post grid array) for low cost package | Jesus Mennen Belonio, Jr. | 2021-08-17 |