Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158551 | Modular WLCSP die daisy chain design for multiple die sizes | Duncan Barclay, Edward Horsburgh | 2021-10-26 |
| 11114359 | Wafer level chip scale package structure | Shou-Cheng Hu, Ian Kent, Ernesto Gutierrez, III, Jerry Li | 2021-09-07 |
| 11094669 | Wafer level molded PPGA (pad post grid array) for low cost package | Shou-Cheng Hu | 2021-08-17 |
| 11075167 | Pillared cavity down MIS-SIP | Ernesto Gutierrez, III, Eric Hu, Melvin Martin, Jerry Li, Francisco Vergara Cadacio | 2021-07-27 |