Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114359 | Wafer level chip scale package structure | Jesus Mennen Belonio, Jr., Shou-Cheng Hu, Ian Kent, Jerry Li | 2021-09-07 |
| 11075167 | Pillared cavity down MIS-SIP | Jesus Mennen Belonio, Jr., Eric Hu, Melvin Martin, Jerry Li, Francisco Vergara Cadacio | 2021-07-27 |
| 11053933 | Displacement control valve | Matthew R. Warren, Daichi Kurihara, Takahiro Ejima, Wataru Takahashi, Kohei Fukudome +3 more | 2021-07-06 |