Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114359 | Wafer level chip scale package structure | Jesus Mennen Belonio, Jr., Shou-Cheng Hu, Ian Kent, Ernesto Gutierrez, III | 2021-09-07 |
| 11075167 | Pillared cavity down MIS-SIP | Ernesto Gutierrez, III, Jesus Mennen Belonio, Jr., Eric Hu, Melvin Martin, Francisco Vergara Cadacio | 2021-07-27 |
| 11008958 | Dual-fuel integrated switch | Tonny Tang | 2021-05-18 |