Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114359 | Wafer level chip scale package structure | Jesus Mennen Belonio, Jr., Shou-Cheng Hu, Ernesto Gutierrez, III, Jerry Li | 2021-09-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114359 | Wafer level chip scale package structure | Jesus Mennen Belonio, Jr., Shou-Cheng Hu, Ernesto Gutierrez, III, Jerry Li | 2021-09-07 |