Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11004827 | Semiconductor package and manufacturing method of semiconductor package | Wei-Kang Hsieh, Hung-Yi Kuo, Hao-Yi Tsai, Kuo Lung Pan, Tin-Hao Kuo +3 more | 2021-05-11 |
MC
Mao-Yen Chang
Overall (2021): #353,967 of 548,734Top 65%
1
Patents 2021