Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11101209 | Redistribution structures in semiconductor packages and methods of forming same | Chung-Shi Liu, Chien-Hsun Lee, Jiun Yi Wu, Hao-Cheng Hou, Hung-Jen Lin +3 more | 2021-08-24 |
| 11101347 | Confined source/drain epitaxy regions and method forming same | Jeng-Wei Yu, Tsz-Mei Kwok, Tsung-Hsi Yang, Ming-Hua Yu | 2021-08-24 |
| 11037826 | Semiconductor device having merged epitaxial features with arc-like bottom surface and method of making the same | Yi-Jing Lee, Jeng-Wei Yu, Tsz-Mei Kwok, Ming-Hua Yu | 2021-06-15 |