Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145603 | Integrated circuit packaging system with shielding and method of manufacture thereof | Byung Joon Han, Il Kwon Shim, KyoungHee Park, KyoWang Koo, In Sang Yoon +5 more | 2021-10-12 |
| 11127666 | Semiconductor device and method of forming openings through insulating layer over encapsulant for enhanced adhesion of interconnect structure | Kang Chen, Jianmin Fang | 2021-09-21 |
| 11024561 | Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units | Il Kwon Shim, Pandi C. Marimuthu, Kang Chen, Yu Gu | 2021-06-01 |
| 11024585 | Integrated circuit packaging system with shielding and method of manufacture thereof | Byung Joon Han, Il Kwon Shim, KyoungHee Park, KyoWang Koo, In Sang Yoon +5 more | 2021-06-01 |
| 11011423 | Semiconductor device and method of using a standardized carrier in semiconductor packaging | Thomas Strothmann, Damien M. Pricolo, Il Kwon Shim, Heinz-Peter Wirtz, Seung Wook Yoon +1 more | 2021-05-18 |
| 10998248 | Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die | Reza A. Pagaila, Jun Mo Koo | 2021-05-04 |