Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10998248 | Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die | Reza A. Pagaila, Yaojian Lin | 2021-05-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10998248 | Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die | Reza A. Pagaila, Yaojian Lin | 2021-05-04 |