Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127668 | Semiconductor device and method of forming double-sided fan-out wafer level package | Il Kwon Shim, Won Kyoung Choi, Sze Ping Goh, Jose Alvin Caparas | 2021-09-21 |
| 11024561 | Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units | Il Kwon Shim, Yaojian Lin, Kang Chen, Yu Gu | 2021-06-01 |
| 11011423 | Semiconductor device and method of using a standardized carrier in semiconductor packaging | Thomas Strothmann, Damien M. Pricolo, Il Kwon Shim, Yaojian Lin, Heinz-Peter Wirtz +1 more | 2021-05-18 |