HW

Heinz-Peter Wirtz

SC Stats Chippac: 1 patents #19 of 28Top 70%
📍 Döttingen, CH: #1 of 3 inventorsTop 35%
Overall (2021): #435,574 of 548,734Top 80%
1
Patents 2021

Issued Patents 2021

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11011423 Semiconductor device and method of using a standardized carrier in semiconductor packaging Thomas Strothmann, Damien M. Pricolo, Il Kwon Shim, Yaojian Lin, Seung Wook Yoon +1 more 2021-05-18