Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145603 | Integrated circuit packaging system with shielding and method of manufacture thereof | Byung Joon Han, KyoungHee Park, Yaojian Lin, KyoWang Koo, In Sang Yoon +5 more | 2021-10-12 |
| 11127668 | Semiconductor device and method of forming double-sided fan-out wafer level package | Pandi C. Marimuthu, Won Kyoung Choi, Sze Ping Goh, Jose Alvin Caparas | 2021-09-21 |
| 11024561 | Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units | Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Yu Gu | 2021-06-01 |
| 11024585 | Integrated circuit packaging system with shielding and method of manufacture thereof | Byung Joon Han, KyoungHee Park, Yaojian Lin, KyoWang Koo, In Sang Yoon +5 more | 2021-06-01 |
| 11011423 | Semiconductor device and method of using a standardized carrier in semiconductor packaging | Thomas Strothmann, Damien M. Pricolo, Yaojian Lin, Heinz-Peter Wirtz, Seung Wook Yoon +1 more | 2021-05-18 |