Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127668 | Semiconductor device and method of forming double-sided fan-out wafer level package | Il Kwon Shim, Pandi C. Marimuthu, Won Kyoung Choi, Jose Alvin Caparas | 2021-09-21 |