Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11043471 | Mixed-orientation multi-die integrated circuit package with at least one vertically-mounted die | Justin Hiroki Sato | 2021-06-22 | $291,132,000 |
| 10896888 | Integrated circuit (IC) device including a force mitigation system for reducing under-pad damage caused by wire bond | Justin Hiroki Sato, Andrew Taylor | 2021-01-19 | $184,231,000 |