Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11062969 | Wafer level chip scale package structure and manufacturing method thereof | Cheow Khoon Oh, Ming-Chen Lu, Xiaoming Sui, Vincent Xue | 2021-07-13 |
| 10991660 | Semiconductor package having high mechanical strength | Long Wang, Zhen Du, Jun Lu, Yueh-Se Ho | 2021-04-27 |