Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11062969 | Wafer level chip scale package structure and manufacturing method thereof | Cheow Khoon Oh, Xiaoming Sui, Bo Chen, Vincent Xue | 2021-07-13 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11062969 | Wafer level chip scale package structure and manufacturing method thereof | Cheow Khoon Oh, Xiaoming Sui, Bo Chen, Vincent Xue | 2021-07-13 |