Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10896888 | Integrated circuit (IC) device including a force mitigation system for reducing under-pad damage caused by wire bond | Justin Hiroki Sato, Bomy Chen | 2021-01-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10896888 | Integrated circuit (IC) device including a force mitigation system for reducing under-pad damage caused by wire bond | Justin Hiroki Sato, Bomy Chen | 2021-01-19 |