Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11043471 | Mixed-orientation multi-die integrated circuit package with at least one vertically-mounted die | Bomy Chen | 2021-06-22 |
| 10896888 | Integrated circuit (IC) device including a force mitigation system for reducing under-pad damage caused by wire bond | Bomy Chen, Andrew Taylor | 2021-01-19 |