Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201062 | Method and apparatus for processing a substrate | Toru Hisamatsu, Kae KUMAGAI | 2021-12-14 |
| 11167379 | Solder alloy, solder ball, solder preform, solder paste and solder joint | Hikaru Nomura, Takashi Saito, Naoko IZUMITA, Shunsaku Yoshikawa | 2021-11-09 |