Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11167379 | Solder alloy, solder ball, solder preform, solder paste and solder joint | Yuki Iijima, Takashi Saito, Naoko IZUMITA, Shunsaku Yoshikawa | 2021-11-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11167379 | Solder alloy, solder ball, solder preform, solder paste and solder joint | Yuki Iijima, Takashi Saito, Naoko IZUMITA, Shunsaku Yoshikawa | 2021-11-09 |