Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11167379 | Solder alloy, solder ball, solder preform, solder paste and solder joint | Yuki Iijima, Hikaru Nomura, Takashi Saito, Shunsaku Yoshikawa | 2021-11-09 |
| 10967464 | Solder alloy, solder paste, and solder joint | Shunsaku Yoshikawa, Yoshie Tachibana | 2021-04-06 |