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Chen Wu — 4 Patents in 2021

STSandisk Technologies: 4 patents #46 of 332Top 15%

Leuven, BE: #3 of 124 inventorsTop 3%

Overall (2021): #52,183 of 548,734Top 10%

4 Patents 2021

Issued Patents 2021

Showing 1–4 of 4 patents

Patent #	Title	Co-Inventors	Date
11094653	Bonded assembly containing a dielectric bonding pattern definition layer and methods of forming the same	Peter Rabkin, Yangyin Chen, Masaaki Higashitani	2021-08-17
11088116	Bonded assembly containing horizontal and vertical bonding interfaces and methods of forming the same	Peter Rabkin, Masaaki Higashitani	2021-08-10
11037908	Bonded die assembly containing partially filled through-substrate via structures and methods for making the same	Peter Rabkin, Yangyin Chen, Masaaki Higashitani	2021-06-15
11004773	Porous barrier layer for improving reliability of through-substrate via structures and methods of forming the same	Peter Rabkin, Masaaki Higashitani	2021-05-11

Chen Wu — 4 Patents in 2021

Issued Patents 2021

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