Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11094653 | Bonded assembly containing a dielectric bonding pattern definition layer and methods of forming the same | Peter Rabkin, Yangyin Chen, Masaaki Higashitani | 2021-08-17 |
| 11088116 | Bonded assembly containing horizontal and vertical bonding interfaces and methods of forming the same | Peter Rabkin, Masaaki Higashitani | 2021-08-10 |
| 11037908 | Bonded die assembly containing partially filled through-substrate via structures and methods for making the same | Peter Rabkin, Yangyin Chen, Masaaki Higashitani | 2021-06-15 |
| 11004773 | Porous barrier layer for improving reliability of through-substrate via structures and methods of forming the same | Peter Rabkin, Masaaki Higashitani | 2021-05-11 |