Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11094653 | Bonded assembly containing a dielectric bonding pattern definition layer and methods of forming the same | Chen Wu, Peter Rabkin, Masaaki Higashitani | 2021-08-17 |
| 11037908 | Bonded die assembly containing partially filled through-substrate via structures and methods for making the same | Chen Wu, Peter Rabkin, Masaaki Higashitani | 2021-06-15 |