Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11094862 | Semiconductor device with through holes on bonding parts and bonding method thereof | Biing-Seng Wu, Hsing-Ying Lee | 2021-08-17 |
| 11063180 | Support structure with sacrifice structure for light-emitting diode and manufacturing method thereof | Biing-Seng Wu, Chun-Jen Weng | 2021-07-13 |
| 11011574 | Top emission microLED display and bottom emission microLED display and a method of forming the same | Biing-Seng Wu | 2021-05-18 |
| 10978332 | Vacuum suction apparatus | Biing-Seng Wu, Tzung-Ren Wang | 2021-04-13 |