Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145637 | Semiconductor package including a substrate having two silicon layers formed on each other | Yanggyoo Jung, Chulwoo Kim, Yun-Seok Choi | 2021-10-12 |
| 10950521 | Thermal interface material layer and package-on-package device including the same | Min-Ok Na, Jongkook Kim, Jin-Woo Park, BongJin Son, Jangwoo Lee | 2021-03-16 |