Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145637 | Semiconductor package including a substrate having two silicon layers formed on each other | Chulwoo Kim, Hyo-Chang Ryu, Yun-Seok Choi | 2021-10-12 |
YJ
Yanggyoo Jung
Overall (2021): #205,735 of 548,734Top 40%
1
Patents 2021