Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145637 | Semiconductor package including a substrate having two silicon layers formed on each other | Yanggyoo Jung, Chulwoo Kim, Hyo-Chang Ryu | 2021-10-12 |
| 11081440 | Interposer and semiconductor package including the same | Yu-Kyung Park, Seung-Kwan Ryu, Min-Seung Yoon | 2021-08-03 |
| 11016097 | Sensors and assays for ubiquitin or ubiquitin-like proteins | Robert E. Cohen | 2021-05-25 |