Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10950521 | Thermal interface material layer and package-on-package device including the same | Min-Ok Na, Jongkook Kim, Hyo-Chang Ryu, Jin-Woo Park, Jangwoo Lee | 2021-03-16 |
BS
BongJin Son
Overall (2021): #514,345 of 548,734Top 95%
1
Patents 2021