Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10950521 | Thermal interface material layer and package-on-package device including the same | Jongkook Kim, Hyo-Chang Ryu, Jin-Woo Park, BongJin Son, Jangwoo Lee | 2021-03-16 |
MN
Min-Ok Na
Overall (2021): #330,132 of 548,734Top 65%
1
Patents 2021