| 11211290 |
MIM capacitor with adjustable capacitance via electronic fuses |
Jin-Su Ko, Beomsup Kim, Periannan Chidambaram |
2021-12-28 |
| 11201127 |
Device comprising contact to contact coupling of packages |
Milind Shah, Periannan Chidambaram |
2021-12-14 |
| 11189686 |
Integrated device coupled to a capacitor structure comprising a trench capacitor |
Milind Shah, Periannan Chidambaram |
2021-11-30 |
| 11158590 |
Capacitor interposer layer (CIL) in a die-to-wafer three-dimensional (3D) integrated circuit (IC) (3DIC) |
Je-Hsiung Lan, Jinseong Kim, Periannan Chidambaram |
2021-10-26 |
| 11152272 |
Die-to-wafer hybrid bonding with forming glass |
Je-Hsiung Lan, Ranadeep Dutta |
2021-10-19 |
| 11145768 |
Trench capacitor component with reduced equivalent series resistance and equivalent series inductance |
Periannan Chidambaram |
2021-10-12 |
| 11121699 |
Wideband filter with resonators and inductors |
Kai Liu, Rui Tang, Changhan Hobie Yun, Mario Francisco Velez |
2021-09-14 |
| 11101228 |
Integrated circuit package with a magnetic core |
Milind Shah, Periannan Chidambaram |
2021-08-24 |
| 11073869 |
Electronic device with coating for protection of window |
Sungho AHN |
2021-07-27 |
| 11024454 |
High performance inductors |
Daeik Daniel Kim, Mario Francisco Velez, Changhan Hobie Yun, Niranjan Sunil Mudakatte, Chengjie Zuo +1 more |
2021-06-01 |
| 10944379 |
Hybrid passive-on-glass (POG) acoustic filter |
David Francis Berdy, Changhan Hobie Yun, Shiqun Gu, Niranjan Sunil Mudakatte, Mario Francisco Velez +1 more |
2021-03-09 |
| 10903240 |
Integrated circuits (ICs) on a glass substrate |
Shiqun Gu, Daniel Daeik Kim, Matthew Michael Nowak, Changhan Hobie Yun, Je-Hsiung Lan +1 more |
2021-01-26 |
