Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11101224 | Wrapped signal shielding in a wafer fanout package | Tiejun Liu, Zhao Chen | 2021-08-24 |
| 10971476 | Bottom package with metal post interconnections | Ratibor Radojcic, Dong Wook Kim | 2021-04-06 |
| 10944379 | Hybrid passive-on-glass (POG) acoustic filter | David Francis Berdy, Changhan Hobie Yun, Niranjan Sunil Mudakatte, Mario Francisco Velez, Chengjie Zuo +1 more | 2021-03-09 |
| 10903240 | Integrated circuits (ICs) on a glass substrate | Daniel Daeik Kim, Matthew Michael Nowak, Jonghae Kim, Changhan Hobie Yun, Je-Hsiung Lan +1 more | 2021-01-26 |