RR

Ratibor Radojcic

QU Qualcomm: 1 patents #789 of 1,914Top 45%
Overall (2021): #293,448 of 548,734Top 55%
1
Patents 2021

Issued Patents 2021

Patent #TitleCo-InventorsDate
10971476 Bottom package with metal post interconnections Shiqun Gu, Dong Wook Kim 2021-04-06