Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158590 | Capacitor interposer layer (CIL) in a die-to-wafer three-dimensional (3D) integrated circuit (IC) (3DIC) | Jonghae Kim, Jinseong Kim, Periannan Chidambaram | 2021-10-26 |
| 11152272 | Die-to-wafer hybrid bonding with forming glass | Jonghae Kim, Ranadeep Dutta | 2021-10-19 |
| 10903240 | Integrated circuits (ICs) on a glass substrate | Shiqun Gu, Daniel Daeik Kim, Matthew Michael Nowak, Jonghae Kim, Changhan Hobie Yun +1 more | 2021-01-26 |