Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211290 | MIM capacitor with adjustable capacitance via electronic fuses | Jonghae Kim, Jin-Su Ko, Beomsup Kim | 2021-12-28 |
| 11201127 | Device comprising contact to contact coupling of packages | Jonghae Kim, Milind Shah | 2021-12-14 |
| 11189686 | Integrated device coupled to a capacitor structure comprising a trench capacitor | Jonghae Kim, Milind Shah | 2021-11-30 |
| 11158590 | Capacitor interposer layer (CIL) in a die-to-wafer three-dimensional (3D) integrated circuit (IC) (3DIC) | Je-Hsiung Lan, Jonghae Kim, Jinseong Kim | 2021-10-26 |
| 11145768 | Trench capacitor component with reduced equivalent series resistance and equivalent series inductance | Jonghae Kim | 2021-10-12 |
| 11101228 | Integrated circuit package with a magnetic core | Jonghae Kim, Milind Shah | 2021-08-24 |