Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201127 | Device comprising contact to contact coupling of packages | Jonghae Kim, Periannan Chidambaram | 2021-12-14 |
| 11189686 | Integrated device coupled to a capacitor structure comprising a trench capacitor | Jonghae Kim, Periannan Chidambaram | 2021-11-30 |
| 11101228 | Integrated circuit package with a magnetic core | Jonghae Kim, Periannan Chidambaram | 2021-08-24 |