Thomas B. Richardson — 2 Patents at Macdermid Enthone

Issued Patents 2021

Showing 1–2 of 2 patents

Patent #	Title	Co-Inventors	Date
11168406	Leveler compositions for use in copper deposition in manufacture of microelectronics	Vincent Paneccasio, Jr., Kyle Whitten, Ivan Li	2021-11-09
11124888	Copper deposition in wafer level packaging of integrated circuits	Kyle Whitten, Vincent Paneccasio, Jr., John Commander, Richard Hurtubise	2021-09-21